The integration and testing processes for the ICON payload have begun! All of the instruments have been shipped to the Space Dynamics Laboratory (SDL) in Logan Utah and integrated into the payload deck, with the Instrument Control Package due for shipment by the end of the month. IVM-B is coming soon as well, closing out the full complement of instruments.

The integration and testing - or I&T - procedures are a vital part of preparing for flight. The instruments have been built all over the country - California, Texas, and Virginia. In order to ensure that they will be able to function together as planned, they are brought together on the Payload Integration Plate (PIP). The PIP, the instruments, and the Instrument Control Package together become the science payload, which will then undergo a series of thorough vibration and thermal tests at SDL over the coming months.

Following I&T, the payload will be shipped from Utah to Orbital ATK in Virginia, where it will be integrated onto the main spacecraft “bus” - the guts of the satellite that controls communication, attitude, and other overall controls. This will happen towards the end of 2016, in preparation for launch in summer 2017.

ICON’s Michelson Interferometer for Global High-resolution Thermospheric Imaging (MIGHTI) instrument includes two identical optical assemblies, one for each of the perpendicular fields of view that will observe thermospheric wind-vector and temperature profiles. An engineering unit of the optical assembly was completed and successfully vibration tested in June 2015 at the Naval Research Laboratory.